Samsung Galaxy S7: A Glance at The Rumored Specs, Device May Come with Heat Pipes, And More

It has been more than six months since Samsung launched its flagship models- the Samsung Galaxy S6 and the Samsung Galaxy S6 Edge. Rumors are already starting to build up regarding the next high-end phone from Samsung, the Samsung Galaxy S7.

With the Galaxy S6, Samsung introduced major changes in the build-quality department. The polycarbonate plastic casing which were used to build up older phones were done away with and the Galaxy S6 came with a metal body complete with glass paneling. It is being rumored that the South Korean Tech giant will use the same components to build up the upcoming Galaxy S7.

The 6013 aluminum which was used to build up the S7 may be replaced by a magnesium alloy in the S7 which will give the device more strength and make it more durable.

With the S6 series, Samsung brought in a lot of new features into the market. Reports are stating that the S7 will be even better and enhanced in all the departments.

Sources are stating that Samsung is more focused in bringing improvements to the hardware of the device rather than it a design overhaul.

The Samsung Exynos 8890 chipset which will reportedly be used in the S7 had recently passed a benchmark test with flying colors. The chipset was put through the AnTuTu benchmark test and it was able to achieve a whopping 103,692 points in it.

Compared to the Kirin 950 SoC from Huawei which scored 65,179 in some similar tests, it could be safely stated that the Exynos 8890 is definitely going to be a force to be reckoned with.

However, there has been no official news from Samsung yet as to which processor will finally make its way under the device’s hood. Rumors are suggesting that there is a possibility that different processors will be used for the S7 based on different regions.

It was reported that the S7 devices that will be launched in China and America will come with the Qualcomm Snapdragon 820 processor. The rest of the world will get S7s which will have the Exynos 8890 processor from Samsung.

According to one of our sources, Samsung is reportedly looking to incorporate heat pipes in the upcoming S7 which will encounter the overheating problem of the Snapdragon 820.

The Snapdragon 810 processor suffered the same problem of overheating and thus it was not able to create a big market for itself. It looks like the heating issue is persisting in the Snapdragon 820 too.

Samsung is trying and testing many types of heat pipes on the S7 which will enable it to dissipate heat fast and counter the overheating problem of the 820. However, it is not good news for the Snapdragon 820 if it suffers the same problem of its predecessor.

The developers of the processor must look into the matter and work towards removing the problem if they want the 820 to make a name for itself in the current competitive market.

Regarding the display of the device, a popular website reported that rumors are stating that the Galaxy S7 is set to sport a 5.2-inch screen like that of the S6. The screen will have a Quad HD Display with 2560 x 1440 pixels resolution.

Another version of the S7 is also expected to make its appearance and this version will have a curved display. This device will be called the Samsung Galaxy S7 Edge and it will reportedly come with a 5.7-inch screen with the same 2560 x 1440 pixels Quad HD display as that of the S7.

The microSD card support feature was badly missed in the S6 as it came without a microSD card slot. The company has reportedly decided to bring this feature back with the Galaxy S7 which is definitely good news for the fans.

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